OCR For Soft Laser Mark
- Suitable for:Si wafer
- Main Mechanism composition:
1.Loading 1
2.Loading 2
3.Loading 3
4.NG
5.Laser Mark inspection
6.OCR inspection
- Process
- Advantages
- Specifications
Production:

Laser mark inspection:


- Accurately recognize fonts efficiently with Line Scan.
- With the Font Recognition Algorithm, even if the font is skewed or scaled, it can be easily recognized.
- The software is easy to operate, learns characters quickly, provides the best visual inspection results, and improves production efficiency and quality.
- Horizontal ROBOT wafer pick-and-place to increase capacity.
- Mapping function for effective detection of wafers.
- Optimized LOG Functions to Improve Data queries.
- Production efficiency: WPH ≧ 250 (with out mapping)
Model | WGR1750-5-OCR-2 |
---|---|
Machine dimensions | ~ 1200mm (L) x 1800mm (W) x 2400mm (H) |
Production efficiency | WPH ≧ 250 |
Power supply | Single phase 220VAC 60HZ |
Air pressure | 5kg/cm^2 |
Vacuum | -80kpa |
Machine weight | ~1050kg |
Control system | PLC + PC |
Operation Interface | Industrial computer host/monitor + touch screen |
Place of use | After laser marking: Check for duplicates, blurred, or missing fonts. Before shipment: Check for duplicates, blurred, or missing fonts. |