OCR For Soft Laser Mark

  • Suitable for：Si wafer
  • Main Mechanism composition： 1.Loading 1
    2.Loading 2
    3.Loading 3
    4.NG
    5.Laser Mark inspection
    6.OCR inspection

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  • Process
  • Advantages
  • Specifications

Production：

 

 

Laser mark inspection：

 

 

  • Accurately recognize fonts efficiently with Line Scan.
  • With the Font Recognition Algorithm, even if the font is skewed or scaled, it can be easily recognized.
  • The software is easy to operate, learns characters quickly, provides the best visual inspection results, and improves production efficiency and quality.
  • Horizontal ROBOT wafer pick-and-place to increase capacity.
  • Mapping function for effective detection of wafers.
  • Optimized LOG Functions to Improve Data queries.
  • Production efficiency: WPH ≧ 250 (with out mapping)
Model WGR1750-5-OCR-2
Machine dimensions ~ 1200mm (L) x 1800mm (W) x 2400mm (H)
Production efficiency WPH ≧ 250
Power supply Single phase 220VAC 60HZ
Air pressure 5kg/cm^2
Vacuum -80kpa
Machine weight ~1050kg
Control system PLC + PC
Operation Interface Industrial computer host/monitor + touch screen
Place of use After laser marking: Check for duplicates, blurred, or missing fonts.
Before shipment: Check for duplicates, blurred, or missing fonts.
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